Integrated Dryer Brochure  Semiconductor Wet Processing Full-Auto


The Genesis X dryer produces superior surface conditioning for semiconductor processing.

  • Robust

  • EfficientSemiconductor, Wet Processing

  • CleanGenesisX2 Marangoni Dryer

  • Cost Effective

Varying Dryer Designs to Match Varying Industry Needs

  • Integrated DI water filtration option
  • Recirculating IPA for reduced IPA usage
  • Low cost of ownershipmarangoni Dryer 20154

Revolution & Advancer Wet Process Systems 

Marangoni Dryer Integration

Enables Dry In- Dry Out processing

  • Simplified marangoni dryer design
  • Teflon cassettes @ > 200nm w/5mm EE
  • Static wafer lifter
  • Hydrophobic or philic surfaces
  • Particle performance < 20 @ 0.2um
  • Uses Teflon cassettes
  • Ideal for drying thin wafers
  • Typical 7–20 min cycle time
  • Will not damage photoresist

Evolution Wet BenchMEI Marangoni Dryer

Marangoni Dryer Integration

Enables Dry In- Dry Out processing

  • Active lifter for independent wafer
  • Low mass carrier drying @ 30nm w/3mm EE
  • Slow pull wafer lifter
  • Wafers dried independent of carrier
  • Phobic or philic surfaces
  • Particle performance < 20 @ 0.065um
  • Uses low mass wafer carrier
  • Optional IPA recirculation & filtration to 15nm
  • Typical 7–10 min cycle time
  • Will not damage photoresist

 

Injection: O3, HF or HCl Injection for “Critical Clean” ApplicationsMarangoni, Dryer, Wet Processing, Semiconductor

  • Produces oxide free H terminated surface with no air interface
  • HF injection is best used for complete oxide strip applications
  • Combination HF, HCL and DIO3 rinse provides high quality surfaces
  • Cycle times are application dependent

 

MEI Dryers are monitored and controlled by IDX Flexware

IDX Flexware logo - Color Corrected