Wet Bench Application: Silicon Wet Etch (KOH etch)

ConsistentEtch

Superior KOH Etch Solution

Consistent Etch Performance

  • Via Closed Loop Process Control
  • Advanced Tank Designs & Flow Controls
  • Rapid Robot Transfer to Rinse in Less than Five Seconds

Etch Rate Uniformity (200mm)

 

  • Wafer to Wafer < 1%
  • Within Wafer < 1%
  • Lot to Lot < 1%
  • Tank to Tank < 1%

No Contamination

 

  • Particle Neutral at 0.12 μ
  • Metallic Contamination < 1E10
  • Integrated Dryer

Etch Stability Concentration Control

TopEtch

 

  • Hyper Accurate Concentration Controls
  • Hyper Accurate Spiking Capability(Chemical & DI)
  • Automatic Compensation for Losses Due to Consumption & Evaporation

Increased Reliability

  • MTBF < 1500 Hr. (Semi E10)
  • Avg MTTR < 1 Hr.
  • Higher Uptime > 95%
  • Reduced Scrap
  • No Complex Wafer Handling

Wet Etching Process Application Solutions

Advanced Silicon Etch

MEI Wet Process Equipment Handles all of the standard Wet Etch Processes:

  • Standard etching processes to include:
    (HF /HNO3, KOH, NaOH, H3PO4, BOE, DHF , SPM, and SOM)
  • Precise transfer times
  • Homogeneous etching over entire 300 mm wafer
  • Fully automatic process control